Bonding Wire Packaging Materials Market Size, Share & Industry Analysis, By Material ( Gold, Palladium-coated copper (PCC), Copper, Silver ), By End Use ( Electrical , Integrated Circuit, Others ) and regional Forecast, 2024-2032

Wire bonding is a common connectivity technique used for providing electrical microchips to the module chip pack connectors or specifically to the substrate. This helps build electrical ties between semiconductors or other electronic using wires. The wire bonding is used to link an integrated cuircuit to other electronic components, or to attach from one printed circuit board to another. Wire bonding is widely regarded as the most cost-effective and versatile interconnecting technology and is used to combine a large bulk of microprocessor packages. Fine and super-fine palladium, copper, silver and gold are used in the manufacture of these bonding wires. The diameter of the bonding wires varies from 15 micrometers to several hundred micrometers for high voltage applications.

The increasing need for miniaturization has resulted in rising application of bondig wire packaging as a crucial component in the semiconductor industry. As these industries are continuously changing, there is a demand for more lightweight and innovative packaging solutions, such as wires with smaller diameters. Thus fuelling the market growth for bonding wire packaging materialss. However, the availability of alternatives such as flip chip packaging limits market growth. There are alternatives which offers an interconnected area which helps to lower the interconnected input impedance, enabling better intensity output. Thus wide accepatance of substitutes is impacting the growth of the market.

Market Segmentation:

Based on material, the market for global bonding wire packaging materials is segmented into gold, palladium-coated copper (PCC), copper and silver. On the basis of end use the market is classified into electrical, integrated circuit, and others. From a geographical standpoint, the market is categorized into North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa.

Key Market Driver -

Increasing demand for small diameter wires for miniaturization in the semi-conductor industry is driving the growth of the market.

Key Market Restraint -

Availability of substitutes is restricting the market growth.

Key Players Covered:

The global bonding wire packaging materialss market is fairly fragmented, with number of players operating in the global markets. Some of the key players in the global bonding wire packaging materialss market includes MK Electron Co Ltd, California Fine Wire Co. , Heraeus Deutschland GmbH & Co. KG , TANAKA Holdings Co., Ltd, Schneider Electric, Electric Wire & Cable, Sumitomo Metal Mining Co., Ltd. , SHINKAWA Electric Co., Ltd. , Palomar Technologies, Inc. , Inseto, EmmTech Calibration, AMETEK, Inc. and others.

Key Insights

• New Advancements in Production Technologies


• Key Trends in the global bonding wire packaging materialss market


• New Product Launches, Expansions, Key Players


• Key Developments by Leading Players operating in the Market

Regional Analysis:

Asia Pacific dominated the global market for bonding wire packaging materialss in 2019. It is due to the growing demand for small diameter wires in the electronic industry. Manufacturing companies use bonded wires as an intermediary commodity and opt for small diameter bonded wires as an easy way to minimize costs. North America shows a considerable growth in the market share due to a combination of technical advances and gained productivity among many major semiconductor manufacturing players in the region. This further contributes to changes in the packaging system that can boost market growth. Due to greater application in the electronics industry, Europe is witnessing a major rise in the market growth. Due to the industrial shift towards using copper materials, it is projected that the requirement for palladium-coated copper wire will increase during the forecast period. The Middle East and the African region are witnessing sluggish growth due to the availability of alternatives such aluminium packaging solutions which can replace the bonding wires and minimise its market demand. Latin America is showing slow growth due to an increase in the price of raw materials, such as gold.

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Segmentation

Global Bonding Wire Packaging Materials Industry Developments

• 24 August 2020, Schneider Electric, a multinational energy management company , has confirmed the introduction of its Silver Ion technology which focuses on self-disinfecting switches. This new technology allows switches to destroy more than 99.9 percent of bacteria and fungi. This launch was intended to accomplish the goals of 'Make in India campaign' by developing electric products in India as Schneider Electric.