Marktgröße, Anteil und Branchenanalyse für Lithographiegeräte, nach Typ (EUV und DUV), nach Technologie (ArF-Scanner, KrF-Stepper, i-line-Stepper, ArF-Immersion, Mask Aligner und andere), nach Anwendungen (Advanced Packaging, LED, MEMs und Leistungsgeräte), nach Verpackungsplattformen (3D-IC, 2,5D-Interposer, Wafer-Level-Chip-Scale-Packaging, FO-WLP-Wafer, 3D-WLP und andere) und regionale Prognose, 2024 – 2032

Letzte Aktualisierung: November 04, 2024 | Format: PDF | Bericht-ID: FBI110434

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ATTRIBUT	DETAILS
Studienzeitraum	2019–2032
Basisjahr	2023
Geschätztes Jahr	2024
Prognosezeitraum	2024–2032
Historischer Zeitraum	2019–2022
Wachstumsrate	CAGR von 9,0 % von 2024 bis 2032
Einheit	Wert (Milliarden USD)
Segmentierung	Nach Typ EUV DUV Nach Technologie ArF-Scanner KrF-Schrittmotoren i-line Stepper ArF-Immersion Masken-Aligner Andere (Laser-Direktbildgebung) Nach Anwendungen Erweiterte Verpackung LED MEMs Stromversorgungsgeräte Von Verpackungsplattformen 3D-IC 2,5D-Interposer Wafer Level Chip Scale Packaging (WLCSP) FO WLP Wafer 3D-WLP Andere (Glass Panel Imposer) Nach Region Nordamerika (nach Typ, nach Technologie, nach Anwendungen, nach Verpackungsplattformen und nach Land) USA Kanada Mexiko Südamerika (nach Typ, nach Technologie, nach Anwendungen, nach Verpackungsplattformen und nach Land) Brasilien Argentinien Restliches Südamerika Europa (nach Typ, nach Technologie, nach Anwendungen, nach Verpackungsplattformen und nach Land) Deutschland Frankreich Italien Spanien Russland Benelux Nordische Länder Restliches Europa Naher Osten und Afrika (nach Typ, nach Technologie, nach Anwendungen, nach Verpackungsplattformen und nach Land) Türkei Israel GCC Südafrika Nordafrika Restlicher Naher Osten und Afrika Asien-Pazifik (nach Typ, nach Technologie, nach Anwendungen, nach Verpackungsplattformen und nach Land) China Indien Japan Südkorea ASEAN Ozeanien Restlicher Asien-Pazifik-Raum

STUDIE ZEITRAUM: 2019-2032
BASE JAHR:2023
HISTORISCH DATEN: 2019-2022
NEIN VON SEITEN: 150

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