Chiplets Market Size, Share & Industry Analysis, By Packing Technology (2.5D/3D, Flip Chip Chip Scale Package, Flip Chip Ball Grid Array, Fan-Out, System-in-Package, and Wafer-Level Chip Scale Package), By Processor (Central Processing Unit, Graphics Processing Unit, Application Processing Unit, Artificial Intelligence Processor-specific Integrated Circuit Coprocessor, Field Programmable Gate Array), By Application (Enterprise Electronics, Consumer Electronics, Automotive, Industrial Automation) & Regional Forecast, 2025 – 2034

ATTRIBUTE

DETAILS

Study Period

2021-2034

Base Year

2025

Estimated Year

2026

Forecast Period

2026-2034

Historical Period

2021-2024

Growth Rate

CAGR of 15.61% from 2026 to 2034

Unit

Value (USD Billion)

Segmentation

By Packing Technology

• 2.5D/3D
• Flip Chip Chip Scale Package (FCCSP)
• Flip Chip Ball Grid Array (FCBGA)
• Fan-Out (FO)
• System-in-Package (SiP)
• Wafer-Level Chip Scale Package (WLCSP)

By Processor

• Central Processing Unit (CPU)
• Graphics Processing Unit (GPU)
• Application Processing Unit (APU)
• Artificial Intelligence Processor-specific Integrated Circuit (AI ASIC) Coprocessor
• Field Programmable Gate Array (FPGA)

By Application

• Enterprise Electronics
• Consumer Electronics
• Automotive
• Industrial Automation
• Military & Aerospace
• Others (Healthcare, etc.)

By Region

• North America (By Packing Technology, Processor, Application, and Country)
  • U.S. (By Application)
  • Canada (By Application)
  • Mexico (By Application)
• South America (By Packing Technology, Processor, Application, and Country)
  • Brazil (By Application)
  • Argentina (By Application)
  • Rest of South America
• Europe (By Packing Technology, Processor, Application, and Country)
  • U.K. (By Application)
  • Germany (By Application)
  • France (By Application)
  • Italy (By Application)
  • Spain (By Application)
  • Russia (By Application)
  • Benelux (By Application)
  • Nordics (By Application)
  • Rest of Europe
• Middle East & Africa (By Packing Technology, Processor, Application, and Country)
  • Turkey (By Application)
  • Israel (By Application)
  • GCC (By Application)
  • North Africa (By Application)
  • South Africa (By Application)
  • Rest of the Middle East & Africa
• Asia Pacific (By Packing Technology, Processor, Application, and Country)
  • China (By Application)
  • Japan (By Application)
  • India (By Application)
  • South Korea (By Application)
  • ASEAN (By Application)
  • Oceania (By Application)
  • Rest of Asia Pacific

Companies Profiled in the Report

Intel Corporation (U.S.)

Advanced Micro Devices, Inc. (U.S.)

Microchip Packing Technology Inc. (U.S.)

IBM Corporation (U.S.)

Marvell Packing Technology Group Ltd. (U.S.)

MediaTek, Inc. (Taiwan)

Achronix Semiconductor Corporation (U.S.)

Renesas Electronics Corporation (Japan)

Global Foundries (U.S.)

Apple Inc. (U.S.)