Temporary Bonding Adhesive Market Size, Share & Industry Analysis, By Type (Thermal Slide-off Debonding, Mechanical Debonding, and Laser Debonding), By Application (MEMS, Advanced Packaging, CMOS, and Others), and Regional Forecast, 2024-2032

Last Updated: March 10, 2025 | Format: PDF | Report ID: FBI111464

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ATTRIBUTE	DETAILS
Study Period	2019-2032
Base Year	2023
Estimated Year	2024
Forecast Period	2024-2032
Historical Period	2019-2022
Unit	Value (USD Thousand) and Volume (Tons)
Growth Rate	CAGR of 8.7% from 2024 to 2032
Segmentation	By Type Thermal Slide-off Debonding Mechanical Debonding Laser Debonding
	By Application MEMS Advanced Packaging CMOS Others
	By Region North America (U.S. and Canada) Europe (Germany, U.K., France, Italy, Russia, and Rest of Europe) Asia Pacific ( China, India, Japan, South Korea, Taiwan, Thailand, Indonesia, Malaysia, Philippines, and Rest of Asia Pacific) Latin America (Brazil, Argentina, Mexico, and Rest of Latin America) Middle East and Africa (Turkey, Saudi Arabia, UAE, Israel, and Rest of Middle East and Africa)