Temporary Bonding Adhesive Market Size, Share & Industry Analysis, By Type (Thermal Slide-off Debonding, Mechanical Debonding, and Laser Debonding), By Application (MEMS, Advanced Packaging, CMOS, and Others), and Regional Forecast, 2026-2034

Last Updated: January 19, 2026 | Format: PDF | Report ID: FBI111464

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ATTRIBUTE	DETAILS
Study Period	2021-2034
Base Year	2025
Estimated Year	2026
Forecast Period	2026-2034
Historical Period	2021-2024
Unit	Value (USD Thousand) and Volume (Tons)
Growth Rate	CAGR of 8.8% from 2026 to 2034
Segmentation	By Type Thermal Slide-off Debonding Mechanical Debonding Laser Debonding
	By Application MEMS Advanced Packaging CMOS Others
	By Region North America (U.S. and Canada) Europe (Germany, U.K., France, Italy, Russia, and Rest of Europe) Asia Pacific ( China, India, Japan, South Korea, Taiwan, Thailand, Indonesia, Malaysia, Philippines, and Rest of Asia Pacific) Latin America (Brazil, Argentina, Mexico, and Rest of Latin America) Middle East and Africa (Turkey, Saudi Arabia, UAE, Israel, and Rest of Middle East and Africa)