Electronic Adhesives Market Size, Share & Industry Analysis, By Type (Epoxy, Silicone, and Others), By End-user (Semiconductor Packaging, Consumer Electronics, Automotive Electronics, Industrial Electronics, and Others), and Regional Forecast, 2026-2034

The global electronic adhesives market size was valued at USD 13.17 billion in 2025. The market is projected to grow from USD 13.96 billion in 2026 to USD 24.08 billion by 2034, exhibiting a CAGR of 6.8% during the forecast period.

Electronic adhesives are specialty polymeric materials used to bond, seal, protect, and thermally manage electronic assemblies and components. They are applied as die-attach and underfill materials in semiconductor packaging; as structural and electrically insulating adhesives in printed circuit board (PCB) assembly; and as potting, encapsulation, gasketing, and thermal interface materials (TIMs) in power modules, sensors, and electronic systems. Electronic adhesives are typically supplied as liquids, pastes, films, or gels and must meet stringent requirements for low ionic contamination, controlled curing behavior, thermal stability, and long-term reliability. A key demand driver is the growing scale and complexity of global electronics and semiconductor production. JEITA’s annual industry survey estimated the global electronics and IT production value at approximately USD 3.99 trillion in 2025 (+8% year-on-year), while WSTS projected the semiconductor market to reach approximately USD 700.9 billion in 2025 (+11.2% year-on-year).

Furthermore, the market is dominated by several major players, including Henkel AG & Co. KGaA, Dow, 3M, Shin-Etsu Chemical, and H.B. Fuller, which are at the forefront of the industry. A broad portfolio, innovative product launches, and strong geographic presence expansion have supported the dominance of these companies in the global market.

ELECTRONIC ADHESIVES MARKET TRENDS

Functional Integration toward Thermal-Management and Protection-First Adhesives are Market Trends

A significant trend is the transition from single-function bonding materials to multifunctional formulations that integrate adhesion with thermal conductivity, electrical insulation, EMI shielding, or environmental protection. This trend is particularly evident in high-power applications where heat flux, voltage, and operating temperatures are escalating, such as in electric vehicle inverters, onboard chargers, and renewable energy power conversion systems.

The trend is reinforced by the rapid expansion of electric mobility: the International Energy Agency (IEA) noted that electric vehicle sales surpassed 17 million worldwide in 2024, accounting for over 20% of all vehicle sales, with further growth anticipated. As electric vehicle platforms transition to higher-voltage architectures, there is a rising demand for silicone gels, potting compounds, and adhesives that possess higher temperature tolerance and long-term stability in power modules.

MARKET DYNAMICS

MARKET DRIVERS

Semiconductor and High-Performance Electronics Growth Raising Adhesive Intensity per Device Accelerating Adoption

Electronic adhesives are becoming increasingly vital in advanced semiconductor packaging and high-density interconnect assemblies, where rising demands for thermo-mechanical stress resistance, miniaturization, and reliability are evident. Underfills, die-attach materials, and encapsulants serve to safeguard solder joints and interconnects against thermal cycling, shock, impact, and vibration, thereby facilitating higher yields and extended operational lifespan.

• Macro demand signals support this trajectory. The World Semiconductor Trade Statistics (WSTS) forecast indicates growth in the global semiconductor market for 2025 and 2026, while the Japan Electronics and Information Technology Industries Association (JEITA) anticipates sustained growth in electronics and IT production from 2024 to 2025. Consequently, the demand for electronic adhesives is positively influenced by both elevated unit volumes and increased material intensity in high-end applications, including AI servers, high-bandwidth memory (HBM) packaging, and power modules.

MARKET RESTRAINTS

Lengthy Qualification Cycles and Compliance Requirements Can Slow Material Substitution

Electronic adhesives are typically qualified at the customer and device levels, with validation conducted through reliability tests such as thermal cycling, humidity bias, and power cycling. These qualification requirements may hinder the adoption of novel chemistries and limit the ability to switch suppliers rapidly, particularly in automotive electronics and mission-critical industrial applications.

Simultaneously, regulatory and customer-imposed chemical compliance obligations, such as restrictions on specific substances and more rigorous documentation standards, may prolong development timelines and limit formulation options, particularly for materials used in consumer electronic devices and electronic manufacturing centers subject to stringent environmental regulations.

MARKET OPPORTUNITIES

De-bondable and Digitally-Optimized Adhesives Enable Repairability and Circular-Economy Design

A significant opportunity exists in adhesive systems that facilitate disassembly, repair, and rework at the end of product life without compromising in-use reliability. As electronics manufacturers strive to reduce waste and enhance reparability, demand is increasing for debonding solutions, low-temperature reworkable materials, and designs that effectively isolate high-value components.

Suppliers are increasingly investing in digital tools to expedite formulation processes and enhance customer adoption. For instance, Henkel AG & Co. KGaA has emphasized AI-driven simulation technologies and advanced innovations in debonding, alongside solutions for thermal management and sealing, specifically tailored for electric vehicle (EV) battery and electronics applications.

MARKET CHALLENGES

Cost Volatility and Process Windows Create Margin and Adoption Pressure

The cost structure of electronic adhesives is influenced by specialty resin inputs, fillers (including thermally conductive particles), and energy-intensive manufacturing processes. Volatility in upstream chemicals and logistics may compress profit margins, particularly for high-volume consumer electronics and electronic assembly applications.

Furthermore, numerous applications require strict process windows, including precise viscosity control for dispensing, compatible cure profiles for temperature-sensitive components, and consistently low ionic cleanliness. Achieving these constraints at scale, while ensuring high yields, remains an operational challenge for producers and electronics manufacturers.

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Segmentation Analysis

By Type

High Demand for Epoxy Contributed to Segmental Growth

Based on type, the market is segmented into epoxy, silicone, and others.

The epoxy segment led the electronic adhesives market share in 2025, owing to its superior adhesion properties, mechanical robustness, and versatility in applications such as die-attach, underfill, structural bonding, and PCB assembly. Epoxies are adaptable for various functionalities, including conductivity (e.g., silver-filled die attach), low modulus (e.g., underfill), and rapid curing, thereby facilitating extensive utilization in both consumer and industrial electronic sectors.

Silicone adhesives are projected to experience the highest compound annual growth rate (CAGR) throughout the forecast period. This growth is driven by advancements in power electronics, electric vehicle (EV) platforms, and renewable energy conversion systems, which require superior temperature resistance, flexibility, and long-term stability. Recent developments, such as Dow’s introduction of a high-temperature silicone gel aimed at next-generation insulated-gate bipolar transistor (IGBT) modules, exemplify the industry’s focus on higher-voltage architectures and increasingly demanding thermal environments.

By End-user

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Semiconductor Packaging Segment to grow with Fastest CAGR during Forecast Period

In terms of end-user, the market is categorized into semiconductor packaging, consumer electronics, automotive electronics, industrial electronics, and others.

The semiconductor packaging segment is expected to grow at the fastest CAGR, driven by increasing semiconductor production, the escalating adoption of advanced packaging solutions, and rising demand for underfills, encapsulants, and die-attach materials. These materials are crucial for protecting fine-pitch interconnects and managing increased thermal loads. The World Semiconductor Trade Statistics (WSTS) forecast, which predicts continuous growth in the semiconductor market through 2026, supports this demand. Additionally, it is projected that this segment will expand at an annual compound growth rate of 8.1% over the specified study period.

The automotive electronics sector is experiencing significant growth, primarily due to the increasing electronic content per vehicle and the rapid expansion of electric vehicles (EVs). The International Energy Agency (IEA) reported that global EV sales surpassed 17 million in 2024, thereby increasing demand for adhesives and gels employed in power modules, sensors, battery thermal management systems, and electronic protection devices.

Electronic Adhesives Market Regional Outlook

By region, the market is categorized into North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa.

Asia Pacific

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The Asia Pacific held the dominant share in 2024, valued at USD 6.46 billion, and also took the leading share in 2025 with USD 7.04 billion. Asia Pacific is the dominant demand center, supported by the region’s concentration of semiconductor assembly and test, consumer electronics manufacturing, and export-oriented supply chains. In 2026, the China market is estimated to reach USD 3.13 billion.

China Electronic Adhesives Market

China is the largest demand center in the Asia Pacific region, driven by its scale in electronics manufacturing, power electronics, and both domestic and export supply chains. Growth is supported by continued investments in higher-value electronics and the scaling of EV powertrains and charging infrastructure, which raise demand for silicone gels, potting materials, and thermal adhesives.

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Japan Electronic Adhesives Market

Japan’s market in 2026 is estimated to be around USD 1.45 billion, accounting for roughly 10.4% of the global electronic adhesives revenues.

India Electronic Adhesives Market

India’s market in 2026 is estimated at around USD 0.63 billion, accounting for roughly 4.5% of global electronic adhesives revenues.

Europe

Europe is expected to experience significant electronic adhesives market growth in the coming years. During the forecast period, the European region is projected to record a growth rate of 5.4% and reach a valuation of USD 2.58 billion in 2026. Europe is characterized by a robust combination of automotive electronics, industrial automation, and high-reliability engineering applications, where compliance and documentation standards are rigorous. The demand is supported by the electrification of EV platforms, industrial power conversion, and building-energy systems that incorporate an increasing number of sensors and electronic components.

U.K. Electronic Adhesives Market

The U.K. market in 2026 is estimated at around USD 0.43 billion, accounting for roughly 3.1% of global electronic adhesives revenues.

Germany Electronic Adhesives Market

Germany’s market in 2026 is estimated at around USD 0.61 billion, accounting for roughly 4.4% of global electronic adhesives revenues.

North America

The market in North America is estimated to reach USD 2.89 billion in 2026 and secure the position of the second-largest region in the market. North America constitutes a mature yet appealing market, where high-value electronics, aerospace and defense industries, data center development, and advanced manufacturing continue to drive demand for specialty adhesives and encapsulants. In 2026, the U.S. market is estimated to reach USD 0.2.56 billion.

U.S. Electronic Adhesives Market

Based on North America’s strong contribution and the U.S. dominance within the region, the U.S. market can be analytically approximated at around USD 2.56 billion in 2026, accounting for roughly 18.3% of global electronic adhesives sales.

Latin America and the Middle East & Africa

Over the forecast period, Latin America and the Middle East & Africa regions are expected to witness moderate growth in this market. The Latin America market in 2026 is expected to reach a valuation of USD 0.50 billion. Latin America and the Middle East & Africa are comparatively smaller markets. However, they are experiencing growth, driven by demand for electronic assembly, industrial systems, and renewable energy infrastructure.

GCC Electronic Adhesives Market

The GCC market in 2026 is estimated to be around USD 0.22 billion, accounting for approximately 1.6% of global electronic adhesives revenues.

COMPETITIVE LANDSCAPE

Key Industry Players

Qualification Support, Reliability, and Application Engineering Are Core Differentiators

The market exhibits moderate fragmentation, with large global materials suppliers competing alongside specialty formulators. Competitive advantage is built on deep application engineering, reliability testing support, customer co-development (especially for packaging and power modules), and a global manufacturing footprint to supply qualification-consistent materials near electronics production clusters. Large incumbents also leverage broad portfolios that span bonding, sealing, and thermal management, enabling them to offer bundled solutions for OEMs and EMS providers. Henkel AG & Co. KGaA, Dow, 3M, Shin-Etsu Chemical, and H.B. Fuller are some of the key players in the market.

LIST OF KEY ELECTRONIC ADHESIVES COMPANIES PROFILED

• Henkel AG & Co. KGaA (Germany)
• Dow (U.S.)
• 3M (U.S.)
• Shin-Etsu Chemical (Japan)
• B. Fuller (U.S.)
• LORD Corporation (Parker Hannifin) (U.S.)
• Huntsman Advanced Materials (U.S.)
• Panasonic Industry (Japan)
• NAMICS Corporation (Japan)
• Master Bond (U.S.)

KEY INDUSTRY DEVELOPMENTS

• October 2025: Henkel AG & Co. KGaA showcased next-generation electronic adhesive solutions emphasizing EMI shielding, thermal management materials, and debonding approaches for electronics and data/telecom applications.
• September 2025: Dow launched DOWSIL EG-4175 Silicone Gel for next-generation IGBT modules designed to withstand up to 180°C, targeting higher-voltage power electronics in EVs and renewable energy systems.
• April 2025: Henkel AG & Co. KGaA highlighted advances in EV battery adhesives, thermal management, and AI-powered simulation tools alongside debonding innovations at The Battery Show Europe.

REPORT COVERAGE

The global market analysis provides an in-depth study of market size & forecast by all the market segments included in the report. It includes details on market dynamics and trends expected to drive the market during the forecast period. It offers information on the technological advancements, new product launches, key industry developments, and details on partnerships, mergers & acquisitions. The market research report also includes a detailed competitive landscape, providing information on market share and profiles of key operating players.

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Report Scope & Segmentation